Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board

ABSTRACT

A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

BACKGROUND OF THE INVENTION

The present application claims priority on Japanese Patent ApplicationNo. 2008-332676, filed Dec. 26, 2008, the content of which isincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to a printed wiring board, a method ofmanufacturing a printed wiring board, and a method of connecting aprinted wiring board. In particular, the present invention relates to aprinted wiring board such that crosstalk between each conductive circuitis prevented when the printed wiring boards are connected to each other,a method of manufacturing such printed wiring board, and a method ofconnecting the printed wiring board.

DESCRIPTION OF THE RELATED ART

The functions of compact electronic devices such as cellular phones arebecoming increasingly sophisticated. Accompanying this trend, there is ademand for reducing the size of electronic components which are equippedon the printed wiring board. Specifically, the size of the electroniccomponents is to be decreased without affecting the function of theelectronic component.

In particular, the height of the connector equipped on the printedwiring board is large, and the connector takes up a large amount of areaon the printed wiring board. As a result, the connector acts as ahindrance to reducing the size of the electronic device and enhancingthe functions of the electronic device.

In order to reduce the volume of this connector, an AnisotropicConductive Film (hereinafter may be referred to as “ACF” in short) isfrequently used in the connection between printed wiring boards incompact electronic devices such as cellular phones. This ACF is aconductive film such that conductive particles (filler) are dispersedinside an adhesive resin such as epoxy resin and acrylic resin.

FIG. 17 is a skeletal cross-sectional diagram representing an example ofa method of connecting a printed wiring board, using a conventionalprinted wiring board.

According to a method of connecting the conventional printed wiringboard shown in FIG. 17, two printed wiring boards (a first printedwiring board 100 and a second printed wiring board 110) are connected toeach other via an ACF 120.

The first printed wiring board 100 includes an insulated substrate 101,a conductive circuit 102 equipped on one side 101 a of the insulatedsubstrate 101, and a cover layer 103 covering the insulated substrate101 and the conductive circuit 102. In addition, a part of theconductive circuit 102 is exposed without being covered by the coverlayer 103.

Similarly, the second printed wiring board 110 includes a conductivecircuit 112 equipped on one side 111 a of an insulated substrate 111,and a cover layer 113 covering the insulated substrate 111 and theconductive circuit 112. In addition, a part of the conductive circuit112 is exposed without being covered by the cover layer 113.

Furthermore, the ACF 120 includes an adhesive resin 121 and conductiveparticles 122 dispersed inside the adhesive resin 121.

In other words, according to the method of connecting the printed wiringboard, a terminal unit 102 a of the conductive circuit 102 of the firstprinted wiring board 100 and a terminal unit 112 a of the conductivecircuit 112 of the second printed wiring board 110 are electricallyconnected to each other via the conductive particle 122, by contactingthe terminal unit 102 a and the terminal unit 112 a with the conductiveparticle 122 of the ACF 120. At the same time, these printed wiringboards are bonded together by the adhesive resin 121. As a result, thecondition in which these printed wiring boards are electricallyconnected to each other is fixed (see, for example, Japanese UnexaminedPatent Application, First Publication No. H7-135039).

However, the method of connecting the printed wiring boards as describedabove using the ACF triggers the following problem, as shown in FIG. 18and illustrated below.

In other words, when the first printed wiring board 200, which includesthe insulated substrate 201 and the conductive circuit 202, is connectedto the second printed wiring board 210, which includes the insulatedsubstrate 211 and the conductive circuit 212, via the ACF 220, theconductive particles 222 dispersed inside the adhesive resin 221 of theACF 200 remain interposed between the terminal unit 202 a of theconductive circuit 202 and the terminal unit 212 a of the conductivecircuit 212 (see, for example, conductive particles 222A shown in FIG.18). In addition, the conductive particles 222 might exist between theterminal units 202 a, or, the conductive particles 222 might existbetween the terminal units 212 a (see, for example, conductive particle222B shown in FIG. 18).

As a result, the completed device obtained by connecting the firstprinted wiring board 200 and the second printed wiring board 210includes the conductive particle 222B, which is unrelated to theelectrical connection between these printed wiring boards. Therefore,there is a problem in that the efficiency with which these printedwiring boards are connected to each other decreases.

In addition, the conductive particle 222B existing between the terminalunits 202 a of the conductive circuit 202 or between the terminal units212 a of the conductive circuit 212 might trigger a crosstalk betweenthese terminal units. Therefore, it is difficult to reduce the distance(pitch) between the terminal unit 202 a and the terminal unit 212 a.Moreover, it is difficult to decrease the area of the printed wiringboard. Furthermore, a crosstalk between the terminal units, triggered bythe conductive particles 222B existing between the terminal units,becomes a hindrance when the method of connecting the printed wiringboards through an ACF is applied to electronic devices used inenvironments of high electric voltage or high electric current.

SUMMARY OF THE INVENTION

The present invention is made considering the problems described above.Accordingly, an object of the present invention is to provide a printingwiring board, a method of manufacturing a printed wiring board, and amethod of connecting a printed wiring board such that crosstalk betweeneach conductive circuit is prevented when the printed wiring boards areconnected to each other.

Namely, a printed wiring board according to an aspect of the presentinvention includes an insulated substrate; a conductive circuit providedon one side of this insulated substrate; a cover layer covering theinsulated substrate and the conductive circuit; and a conductiveparticle buried in this cover layer, wherein the conductive particle isburied in the cover layer so that the conductive particle contacts theconductive circuit and protrudes from the cover layer; and theconductive particle serves as an electric contact point.

In addition, the printed wiring board may be configured as follows: anadhesive layer is provided on at least a part of a side opposite to aside at which the cover layer contacts the conductive circuit, and thisadhesive layer covers the conductive particle.

In addition, the printed wiring board may be configured as follows: theadhesive layer includes a thermoplastic resin.

In addition, the printed wiring board may be configured as follows: thecover layer includes a coverlay film; a pore is provided on thiscoverlay film; an inequality d₁<d₂ is satisfied when an inner diameterof the pore equals d₁ and the diameter of the conductive particle equalsd₂; and the conductive particle is inserted in the pore from a side atwhich the coverlay film contacts the conductive circuit.

In addition, the printed wiring board may be configured as follows: thecover layer includes a coverlay film; a pore is provided on thiscoverlay film, the pore tapering gradually from a first side at whichthe coverlay film contacts the conductive circuit to a second sideopposite to the first side at which the coverlay film contacts theconductive circuit; an inequality d₃<d₄ is satisfied when d₃ equals aninner diameter of the pore at the second side opposite to the first sideat which the coverlay film contacts the conductive circuit, and d₄equals another inner diameter of the pore at the first side at which thecoverlay film contacts the conductive circuit; and the conductiveparticle is inserted in the pore from the first side at which thecoverlay film contacts the conductive circuit.

In addition, the printed wiring board may be configured as follows: theconductive particle includes a resin particle and a metal layer formedon a surface of this resin particle.

Meanwhile, a connection method of a printed wiring board according to anaspect of the present invention connecting a first printed wiring boardincluding an insulated substrate, a conductive circuit provided on oneside of this insulated substrate, a cover layer covering the insulatedsubstrate and the conductive circuit, and a conductive particle buriedin this cover layer, wherein the conductive particle is buried in thecover layer so that the conductive particle contacts the conductivecircuit and protrudes from the cover layer; and a second printed wiringboard including an insulated substrate, a conductive circuit provided onone side of this insulated substrate, a cover layer covering theinsulated substrate and the conductive circuit, wherein at least a partof the conductive circuit is exposed; includes: a step contacting theconductive particle of the first printed wiring board with theconductive circuit of the second printed wiring board; and a stepbonding a contacting portion of the conductive particle and theconductive circuit, as well as an area surrounding the contactingportion, with an adhesive.

In addition, the connection method may be configured as follows: theadhesive includes a thermoplastic resin.

In addition, the connection method may be configured as follows: theadhesive includes an adhesive layer covering the conductive particle;and the adhesive layer is provided on at least a part of a side oppositeto a side at which the cover layer contacts the conductive circuit.

In addition, the connection method may be configured as follows: thecover layer includes a coverlay film; a pore is provided on thiscoverlay film; an inequality d₁<d₂ is satisfied when an inner diameterof the pore equals d₁ and a diameter of the conductive particle equalsd₂; the connection method further comprising a step inserting theconductive particle in the pore from a side at which the coverlay filmcontacts the conductive circuit.

In addition, the connection method may be configured as follows: thecover layer includes a coverlay film; a pore is provided on thiscoverlay film, the pore tapering gradually from a first side at whichthe coverlay film contacts the conductive circuit to a second sideopposite to the first side at which the coverlay film contacts theconductive circuit; an inequality d₃<d₄ is satisfied when d₃ equals aninner diameter of the pore at the second side opposite to the first sideat which the coverlay film contacts the conductive circuit, and d₄equals another inner diameter of the pore at the first side at which thecoverlay film contacts the conductive circuit; and the connection methodfurther includes a step inserting the conductive particle in the porefrom the first side at which the coverlay film contacts the conductivecircuit.

In addition, the connection method may be configured as follows: theconductive particle includes a resin particle and a metal layer formedon a surface of this resin particle; and the conductive particle isconnected to a terminal of the second printed wiring board by pressingthe first printed wiring board and the second printed wiring board, andby having the conductive particle undergo an elastic deformation or aplastic deformation.

Meanwhile, a manufacturing method of a printed wiring board according toan aspect of the present invention including an insulated substrate, aconductive circuit provided on one side of this insulated substrate, acover layer covering the insulated substrate and the conductive circuit,and a conductive particle buried in this cover layer, includes: a stepproviding the conductive circuit on one side of the insulated substrate;a step providing the conductive particle on a side opposite to a side atwhich the conductive circuit contacts the insulated substrate; a stepproviding the cover layer so that at least a top portion of theconductive particle is exposed, and the cover layer covers the insulatedsubstrate and the conductive circuit.

Meanwhile, a manufacturing method of a printed wiring board according toan aspect of the present invention including an insulated substrate, aconductive circuit provided on one side of this insulated substrate, acover layer covering the insulated substrate and the conductive circuit,and a conductive particle buried in this cover layer, includes: a stepproviding the conductive circuit on one side of the insulated substrate;a step using a coverlay film as a material of the cover layer andproviding a pore on this coverlay film; a step packing the conductiveparticle in the pore so that at least a top portion of the conductiveparticle is exposed; and a step bonding the coverlay film, in which theconductive particle is packed, with the insulated substrate, on whichthe conductive circuit is provided, so that the conductive particlecontacts the conductive circuit.

In addition, the manufacturing method may be configured as follows: thestep providing the pore on the coverlay film includes: providing atapered pore on the coverlay film so that a diameter of the tapered poregradually decreases from a side at which the coverlay film contacts theconductive circuit to a side opposite to the side at which the coverlayfilm contacts the conductive circuit.

As described above, the printed wiring board according to an aspect ofthe present invention includes an insulated substrate, a conductivecircuit provided on one side of this insulated substrate, a cover layercovering the insulated substrate and the conductive circuit, and aconductive particle embedded in this cover layer. The conductiveparticle is embedded in the cover layer so that the conductive particleis in contact with the conductive circuit, and the conductive particleprotrudes more than the cover layer. The printed wiring board andanother printed wiring board can be electrically connected through thisconductive particle. Therefore, unlike conventional technology, it isnot necessary to use an ACF. Thus, it is possible to prevent aconductive particle included in the ACF from entering in between theconductive circuits of the printed wiring board and causing a crosstalkbetween the conductive circuits. Therefore, the area of the printedwiring board can be reduced. At the same time, an electronic deviceincluding the printed wiring board can be applied in environments ofhigh electric voltage and high electric current.

According to a method of connecting a printed wiring board based on anaspect of the present invention, a first printed wiring board and asecond printed wiring board are connected to each other, the printedwiring board including an insulated substrate, a conductive circuitprovided on one side of this insulated substrate, a cover layer coveringthe insulated substrate and the conductive circuit, and a conductiveparticle embedded in this cover layer. Regarding the first printedwiring board, the conductive particle is in contact with the conductivecircuit, and the conductive particle is embedded in the cover layer sothat the conductive particle protrudes from the cover layer. The secondprinted wiring board includes an insulated substrate, a conductivecircuit provided in one side of this insulated substrate, and a coverlayer covering the insulated substrate and the conductive circuit,wherein at least a part of the conductive circuit is exposed. Theconductive particle of the first printed wiring board comes in contactwith the conductive circuit of the second printed wiring board. Thiscontacting portion and the area surrounding the contacting portion arebonded with an adhesive. In other words, two printed wiring boards areelectrically connected to each other through a conductive particleprovided on the conductive circuit of the printed wiring board.Therefore, unlike conventional technology, these printed wiring boardscan be connected to each other without using an ACF. Furthermore, it ispossible to prevent a conductive particle, included in the ACF, fromentering in between the conductive circuit of each printed wiring boardand causing a crosstalk between these conductive circuits.

According to a method of manufacturing a printed wiring board based onan aspect of the present invention, a printed wiring board ismanufactured, which includes an insulated substrate, a conductivecircuit provided on one side of this insulated substrate, a cover layercovering the insulated substrate and the conductive circuit, and aconductive particle embedded in this cover layer. This manufacturingmethod includes a step providing the conductive circuit to one side ofthe insulated substrate, a step providing the conductive particle on aside opposite to a side at which the conductive circuit and theinsulated substrate are in contact with each other, and a step providinga cover layer so that at least a top portion of the conductive particleis exposed and the cover layer covers the insulated substrate and theconductive circuit. Therefore, it is possible to manufacture a printedwiring board on which the conductive particle is fixed on the conductivecircuit while the top portion of the conductive particle is protrudingfrom a coverlay film.

According to a method of manufacturing a printed wiring board based onan aspect of the present invention, a printed wiring board ismanufactured, which includes an insulated substrate, a conductivecircuit provided on one side of this insulated substrate, a cover layercovering the insulated substrate and the conductive circuit, and aconductive particle embedded in this cover layer. This manufacturingmethod includes a step providing the conductive circuit on one side ofthe insulated substrate, a step using a coverlay film as the materialfor the cover layer and forming a pore penetrating this coverlay film,and a step placing the conductive particle in the pore so that at leasta top portion of the conductive particle is exposed, and a step bondingthe coverlay film embedded with the conductive particle, with theinsulated substrate on which the conductive circuit is provided, so thatthe conductive particle is in contact with the conductive circuit.Therefore, it is possible to manufacture a printed wiring board suchthat the conductive particle is fixed on the conductive circuit whilethe top portion of the conductive particle is protruding from thecoverlay film.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plane view showing a printed wiring board according to afirst embodiment of the present invention.

FIG. 1B is a skeletal diagram showing a printed wiring board accordingto the first embodiment of the present invention, and is a crosssectional view along an A-A line of FIG. 1A.

FIG. 2 is a skeletal cross sectional diagram showing an example of amethod of manufacturing a printed wiring board according to the firstembodiment of the present invention.

FIG. 3 is a skeletal cross sectional diagram showing another example ofa method of manufacturing a printed wiring board according to the firstembodiment of the present invention.

FIG. 4 is a skeletal cross sectional diagram showing a printed wiringboard according to a second embodiment of the present invention.

FIG. 5A is a skeletal cross sectional diagram showing a method ofconnecting a printed wiring board according to the second embodiment ofthe present invention.

FIG. 5B is a skeletal cross sectional diagram showing a method ofconnecting a printed wiring board according to the second embodiment ofthe present invention.

FIG. 6 is a skeletal cross sectional diagram showing a printed wiringboard according to a third embodiment of the present invention.

FIG. 7 is a skeletal cross sectional diagram showing a printed wiringboard according to a fourth embodiment of the present invention.

FIG. 8 is a skeletal cross sectional diagram showing a method ofmanufacturing a printed wiring board according to the fourth embodimentof the present invention.

FIG. 9 is a skeletal cross sectional diagram showing a method ofmanufacturing a printed wiring board according to the fourth embodimentof the present invention.

FIG. 10 is a skeletal cross sectional diagram showing a method ofmanufacturing a printed wiring board according to the fourth embodimentof the present invention.

FIG. 11 is a skeletal cross sectional diagram showing a method ofmanufacturing a printed wiring board according to the fourth embodimentof the present invention.

FIG. 12 is a skeletal cross sectional diagram showing a method ofmanufacturing a printed wiring board according to the fourth embodimentof the present invention.

FIG. 13 is a skeletal cross sectional diagram showing a method ofmanufacturing a printed wiring board according to the fourth embodimentof the present invention.

FIG. 14 is a skeletal cross sectional diagram showing a method ofconnecting a printed wiring board according to the fourth embodiment ofthe present invention.

FIG. 15 is a skeletal cross sectional diagram showing a method ofconnecting a printed wiring board according to the fourth embodiment ofthe present invention.

FIG. 16 is a skeletal cross sectional diagram showing a method ofconnecting a printed wiring board according to the fourth embodiment ofthe present invention.

FIG. 17 is a skeletal cross sectional diagram showing an example of amethod of connecting a printed wiring board using a conventional printedwiring board.

FIG. 18 is a skeletal cross sectional diagram representing a problemregarding a method of connecting a printed wiring board using aconventional printed wiring board.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereunder, a printed wiring board, a method of manufacturing a printedwiring board, and a method of connecting a printed wiring boardaccording to an aspect of the present invention is described.

The following description aims to provide a detailed explanation tofacilitate the gist of the present invention. Therefore, the followingdescription does not limit the present invention in any way, unlessotherwise noted.

(1) First Embodiment

First, a first embodiment of the present invention is described withrespect to FIGS. 1A to 3. A printed wiring board 10 according to thefirst embodiment of the present invention (hereinafter, may be simplyreferred to as a “printed wiring board”) includes an insulated substrate11, a conductive circuit 12 provided on one side 11 a of the insulatedsubstrate 11, a cover layer 13 covering the insulated substrate 11 andthe conductive circuit 12, and a conductive particle 14 embedded in thecover layer 13.

In addition, the conductive particle 14 is embedded in the cover layer13 so that the conductive particle 14 is in contact with the conductivecircuit 12, and the conductive particle 14 protrudes from the coverlayer 13. In other words, the conductive particle 14 is provided on aside 12 a (hereinafter may be referred to as “a second side”) oppositeto a side at which the conductive circuit 12 and the insulated substrate11 are in contact with each other. The conductive particle 14 is faxedon the second side 12 a of the conductive circuit 12 by the cover layer13, so that at least a top portion of the conductive particle 14 isexposed.

Therefore, the conductive particle 14, which is embedded in the coverlayer 13, acts as an electronic contact point of the printed wiringboard 10.

Furthermore, an opening part 13 a is provided on the cover layer 13 sothat an electronic component can be mounted. The conductive circuit 12is exposed from this opening part 13 a.

There is no limitation regarding the extent to which the conductiveparticle 14 protrudes from the cover layer 13 (in other words, theamount of protrusion of the conductive particle 14). Here, the amount ofprotrusion refers to the distance between a top portion 14 a of theconductive particle 14 and a side 13 b which is opposite to the side atwhich the cover layer 13 is in contact with the conductive circuit. Thisamount of protrusion is measured in the direction of the height of theprinted wiring board 10. The side 13 b may also be referred to as a“third side.” The amount of protrusion can be of any length as long asthe conductive circuit of each printed wiring board comes in contactwith each other only at a predetermined portion (in other words, at theterminal unit), when the printed wiring board 10 is connected to anotherprinted wiring board through the conductive particle 14.

A flexible, insulated material is used as the insulated substrate 11.This insulated substrate 11 may be in the form of a film, a sheet, or athin plate.

A thermoplastic resin is preferred as this type of insulated material.For example, considering a polyimide type resin, an epoxide resin, aliquid crystal polymer (LCP) resin, a glass epoxy, an aramid fiber, andTeflon (registered trademark), at least one type or more than two typesamong the above are used as the insulated substrate 11. Among suchinsulated material, the thermoplastic polyimide type resin is easy touse, and is preferred.

For the conductive circuit 12, a conductive film of metal (metal film)such as copper, silver, and gold is used. Among these metals, copper ispreferred because the specific resistance ρ of copper is low(ρ=1.55μΩ·cm), and because copper is inexpensive.

Examples of the forms of the metal film used as the conductive circuit12 include electrolytic foil, evaporated film, sputtered film, and printfilm formed by printing technology using a conductive paste.

As the material for the cover layer 13, an ordinary, epoxy type soldermask, and a cover-coating material such as a polyimide typecover-coating material, normally used to protect the circuit of theprinted wiring board, are utilized.

For the conductive particle 14, a conductive, spherical particle isused. Examples of such conductive, spherical particle include a copperparticle, a nickel particle coated with gold, a solder particle, amaterial comprising a resin particle and a metal layer provided on asurface of the resin particle (hereinafter, referred to as a“metal-layered resin particle).

There is no limitation in particular on the resin particle included inthe metal-layered resin particle, as long as the resin particle canundergo an elastic deformation and a plastic deformation.

Examples of the metal layer included in the metal-layered resin particleinclude metallic plating such as nickel/gold coating, solder coating,and gold coating.

When the above described metal-layered resin particle is used as theconductive particle 14, and the printed wiring board 10 is connected toanother printed wiring board through the conductive particle 14, theconductive particle 14 undergoes an elastic deformation or a plasticdeformation due to the pressing of the printed wiring board. As aresult, the contact area of the printed wiring board and the conductiveparticle 14 can be enlarged. Consequently, the printed wiring board 10can be electrically contacted with another printed wiring board withmore reliability.

In addition, when multiple conductive particles 14 are provided on theprinted wiring board 10 and the outer diameters of each of theconductive particles are different, or when there is a step (differencein the thickness) between each of the terminals that are connected tothe conductive particles 14 of the other printed wiring board, theterminal and the conductive particle 14 can be connected, due to thedeformation of the conductive particle 14. It should be noted that, whenthere is a disparity in the outer diameter of the conductive particle14, or when there is a difference in the thickness of each terminal, theconductivity may be impaired if the conductive particle does not undergoa deformation.

In addition, there is no particular limitation on the thickness of thecover layer 13 and the diameter of the conductive particle 14. However,when the thickness of the cover layer 13 equals α₁, the radius of theconductive particle 14 equals α₂, and the diameter of the conductiveparticle 14 equals α₃, it is preferable that the variables α₁, α₂, andα₃ satisfy the inequality α₂₃<α₁<α₃, in order to adequately hold theconductive particle 14 with the cover layer 13.

For example, the thickness α₁ of the cover layer 13 is set to 40 μm, andthe diameter α₃ of the conductive particle 14 is set to 75 μm.

According to this printed wiring board 10, the conductive particle 14 isplaced on one side 12 a of the conductive circuit 12. In addition, theconductive particle 14 is fixed to one side 12 a of the conductivecircuit 12 by the cover layer 13, so that at least the top portion 14 aof this conductive particle 14 is exposed. Therefore, the printed wiringboard 10 and another printed wiring board can be electrically connectedvia this conductive particle 14. Thus, unlike conventional printedwiring boards, it is not necessary to use an ACF. Hence, it is possibleto prevent a conductive particle, included in the ACF, from entering thespace between the printed wiring board 10 and the conductive circuit 12,and the space between the printed wiring board and the conductivecircuit that are to be connected. In this way, it is possible to preventthe occurrence of a crosstalk between these conductive circuits.Consequently, the area of the printed wiring board 10 can be reduced. Atthe same time, an electronic device equipped with this printed wiringboard 10 can be used in environments of high electric voltage or highelectric current.

Next, a method of manufacturing this printed wiring board 10 isdescribed with reference to FIGS. 1A and 1B.

First, the conductive circuit 12 is placed on one side 11 a of theinsulated substrate 11.

Next, a cover coating material 13 in liquid form is applied so as tocover the insulated substrate 11 and the conductive circuit 12.

Next, before the cover coating material 13 is solidified, the conductiveparticle 14 is placed at a predetermined position. At this time, theconductive particle 14 is placed so that the conductive particle 14penetrates the cover coating material 13 in liquid form, and so that theconductive particle 14 comes in contact with the conductive circuit 12.

Next, the printed wiring board 10 is obtained by solidifying the covercoating material 13 by heating the cover coating material 13.

Next, a method of connecting the printed wiring board 10 with anotherprinted wiring board is described with reference to FIG. 2.

FIG. 2 is a skeletal cross sectional diagram representing an example ofa connection method based on a first embodiment of the printed wiringboard according to the present invention.

According to the method of connecting the printed wiring board shown inFIG. 2, two printed wiring boards (printed wiring board 10 and printedwiring board 20) are connected via an adhesive 30.

The printed wiring board 20 includes an insulated substrate 21, aconductive circuit 22, and a cover layer 23. The conductive circuit 22is provided on one side 21 a of the insulated substrate 21. The coverlayer 23 is provided to cover the insulated substrate 21 and theconductive circuit 22. In addition, an opening portion 23 a is providedon the cover layer 23. The conductive circuit 22 is exposed from thisopening portion 23 a.

In other words, according to the method of connecting the printed wiringmethod shown in FIG. 2, the printed wiring board 10 and the printedwiring board 20 are electrically connected via the conductive particle14 by contacting the conductive circuit 22 of the printed wiring board20 with the conductive particle 14. This conductive particle 14 isplaced on one side 12 a of the conductive circuit 12 of the printedwiring board 10. At the same time, the contacting portion of theconductive particle and the printed wiring board 10 and the printedwiring board 20, as well as the area surrounding the contacting portion,are bonded using the adhesive 30. As a result, the electric connectionbetween the printed wiring board 10 and the printed wiring board 20 isfixed mechanically.

An adhesive in the form of liquid or a sheet is used as the adhesive 30.The adhesive includes an epoxy adhesive, an acrylic adhesive, apolyimide adhesive, and the like. Among these types of adhesives, anadhesive with a low rate of volume expansion in response to anapplication of heat and humidity is preferred.

In addition, a thermoplastic resin is used as the adhesive 30. Examplesof this thermoplastic resin include polyethylene (PE), polypropylene(PP), polyvinylchloride (PVC), polystyrene (PS), acrylic resin (PMMA),and the like.

When such thermoplastic resin is used as the adhesive 30, the degree ofelasticity changes reversibly in response to heat. Therefore, when thereis a poor connection between the printed wiring board 10 and anotherprinted wiring board, these printed wiring boards can be bonded togetherby first detaching the printed wiring board 10 from the other printedwiring board by heating them again, and then heating them further.

According to the method of connecting the printed wiring board shown inFIG. 2, the printed wiring board 10 and the printed wiring board 20 areelectrically connected through the conductive particle 14. Thisconductive particle 14 is placed on one side 12 a of the conductivecircuit 12 of the printed wiring board 10. Therefore, unlikeconventional technology, these printed wiring boards can be connectedwithout using an ACF. In addition, it is possible to prevent aconductive particle included in the ACF from entering in between theconductive circuit 12 of the printed wiring board 10 or in between theconductive circuit 12 of the printed wiring board 20, and causing acrosstalk between these conductive circuits.

FIG. 3 is a skeletal cross sectional diagram representing anotherexample of a method of connecting the printed wiring board according tothe above embodiment of the present invention.

The connection method of the printed wiring board shown in FIG. 3differs from the connection method of the printed wiring board shown inFIG. 2, in that the above referenced metal-layered resin particle isused as the conductive particle 14, the printed wiring board 10 and theprinted wiring board 20 are sandwiched with a pair of stainless sheets40-40, and these stainless sheets 40-40 are screwed together.

In other words, according to the connection method of the printed wiringboard shown in FIG. 3, the printed wiring board 10 and the printedwiring board 20 are pressed together in the direction in which thesewiring boards face each other (in other words, the direction in whichthese wiring boards approach one another), with the pressure (in otherwords, the pressing force) applied when the stainless sheets 40-40 arescrewed together. As a result, the conductive particle 14 undergoes anelastic deformation or a plastic deformation. Thus, the contacting areabetween the conductive particle 14 and the printed wiring board 10 andthe printed wiring board 20 enlarges.

According to the method of connecting the printed wiring board shown inFIG. 3, the printed wiring board 10 and the printed wiring board 20 arepressed together, the conductive particle 14 undergoes an elasticdeformation or a plastic deformation, and the contact area between theconductive particle 14 and the printed wiring board 10 and the printedwiring board 20 is enlarged. As a result, the printed wiring board 10and the printed wiring board 20 can be electrically connected to eachother with more reliability.

Further, when multiple conductive particles 14 are provided on theprinted wiring board 10 and the outer diameters of each of theconductive particles are different, or when there is a step (differencein the thickness) between each of the terminals that are connected tothe conductive particles 14 of the other printed wiring board, theterminal and the conductive particle 14 can be connected, due to thedeformation of the conductive particle 14. It should be noted that, whenthere is a disparity in the outer diameter of the conductive particle14, or when there is a difference in the thickness of each terminal, theconductivity may be impaired if the conductive particle 14 does notundergo a deformation.

(2) Second Embodiment

FIG. 4 is a skeletal cross sectional diagram representing a printedwiring board according to a second embodiment of the present invention.

In FIG. 4, the components that are the same as those described in thefirst embodiment are referenced using the same reference numbers. Inthis way, components overlapping in the first and second embodimentswill not be described.

The printed wiring board 50 according to the second embodiment differsfrom the printed wiring board 10 according to the first embodiment, inthat an adhesive layer 51 is provided on a part of one side 13 b of thecover layer 13 so as to cover the conductive particle 14.

An adhesive similar to the above referenced adhesive 30 is used as anadhesive comprising the adhesive layer 51.

According to this printed wiring board 50, the adhesive layer 51 isprovided on a part of one side 13 b of the cover layer 13, so as tocover the conductive particle 14. As a result, when this printed wiringboard 50 and another printed wiring board are electrically connected viathe conductive particle 14, it is not necessary to separately prepare anadhesive. Therefore, it is possible to simplify the process ofconnecting the printed wiring board 50 and another printed wiring board.At the same time, it is possible to prevent the contamination of theworking environment and the printed wiring board 50, occurring due tothe application of an adhesive that is prepared separately.

Incidentally, the description of the above embodiment presented as anexample, a printed wiring board 50 such that an adhesive layer 51 isprovided on a part of one side 13 b of the cover layer 13. However, theprinted wiring board according to the present invention is not limitedto this configuration.

The printed wiring board according to the present invention can beconfigured so that an adhesive layer is provided on the entire surfaceof one side of the cover layer.

Next, a manufacturing method of this printed wiring board 50 isdescribed with reference to FIG. 4.

First, a conductive circuit 12 is provided on one side 11 a of theinsulated substrate 11.

Next, a cover-coating layer 13 in liquid form is applied, so as to coverthe insulated substrate 11 and the conductive circuit 12.

Next, before the cover-coating layer 13 is solidified, the conductiveparticle 14 is placed on a predetermined position. At this time, theconductive particle 14 is placed so that the conductive particle 14penetrates the cover-coating layer 13 in liquid form, and comes incontact with the conductive circuit 12.

Next, the cover-coating material 13 is solidified by heating.

Next, the adhesive layer 51 is formed, for example, by applying theadhesive material to a part of one side 13 b of the cover layer 13, soas to cover the conductive particle 14. In this way, the printed wiringboard 50 is obtained.

Next, a method of connecting this printed wiring board 50 with anotherprinted wiring board is described with reference to FIGS. 5A and 5B.

FIGS. 5A and 5B are skeletal cross-sectional diagrams representing asecond embodiment of a connection method of a printed wiring boardaccording to the present invention.

In FIGS. 5A and 5B, the components that are the same as those of thefirst embodiment shown in FIG. 2 are referenced using the same referencenumbers. In this way, overlapping components will not be described.

According to a connection method of a printed wiring board according toa second embodiment of the present invention, two printed wiring boards(printed wiring board 50 and printed wiring board 20) are connected viathe adhesive layer 51 of the printed wiring board 50.

In other words, according to this connection method of the printedwiring board, the adhesive layer 51 of the printed wiring board 50 firstcontacts the cover layer 23 of the printed wiring board 20, so that theconductive particle 14 covered by the adhesive layer 51 is placed at aposition facing the opening portion 23 a of the printed wiring board 20,as shown in FIG. 5A, and is then fixed temporarily to maintain thiscondition.

Next, the adhesive layer 51 is heated, as shown in FIG. 5B. At the sametime, the conductive particle 14 contacts the conductive circuit 22 ofthe printed wiring board 20 by the pressing of the printed wiring board50 against the printed wiring board 20. This conductive particle 14 isplaced on one side 12 a of the conductive circuit 12 of the printedwiring board 50. In this way, the printed wiring board 20 and theprinted wiring board 50 are electrically connected via the conductiveparticle 14. At the same time the contacting portion of the printedwiring board 20, the printed wiring board 50, and the conductiveparticle 14, as well as its surrounding area, are bonded by the adhesivelayer 51. As a result, the electrical connection between these wiringboards is fixed.

In other words, the adhesive making up the adhesive layer 51 is fused byheating the adhesive layer 51. At the same time, the printed wiringboard 50 is pressed against the printed wiring board 20. As a result,the conductive particle 14 penetrates the fused adhesive, and contactsthe conductive circuit 22 of the printed wiring board 20. Then, theheating is suspended, and the adhesive is solidified. In this way, theprinted wiring board 20 is bonded to the printed wiring board 50 via theadhesive layer 51.

According to the method of connecting the printed wiring board based onthe present embodiment, the printed wiring board 20 and the printedwiring board 50 are connected by the adhesive layer 51 covering theconductive particle 14 placed on one side 12 a of the conductive circuit12 of the printed wiring board 50. Therefore, it is not necessary toseparately prepare an adhesive when the printed wiring board 20 iselectrically connected to the printed wiring board 50 via the conductiveparticle 14. Thus, it is possible to simplify the process of connectingthe printed wiring board 20 and the printed wiring board 50. At the sametime, it is possible to prevent the contamination of the workingenvironment, the printed wiring board 20, or the printed wiring board50, occurring due to the application of an adhesive that is preparedseparately.

(3) Third Embodiment

FIG. 6 is a skeletal cross-sectional diagram representing a printedwiring board according to a third embodiment of the present invention.

In FIG. 6, the components that are the same as those described in thefirst embodiment and shown in FIG. 1 are referenced using the samereference numbers. In this way, overlapping components will not bedescribed.

The printed wiring board 60 according to the third embodiment differsfrom the printed wiring board 10 according to the first embodiment, inthat the cover layer includes a coverlay film 61 comprising a resin film62 and an adhesive layer 63 provided on one side 62 a of the resin film62; a pore 62 b is provided on the resin film 62 of this coverlay film61; and a part of the conductive particle 14 is inserted in the pore 62b.

In other words, the adhesive layer 63 is placed so as to cover theconductive circuit 12 and the conductive particle 14 provided on oneside 12 a of the conductive circuit 12. At the same time, the coverlayfilm 61 is provided so that a part of the conductive particle 14 isinserted in the pore 62 b of the resin film 62 from one side 62 a of theresin film 62, in other words, from a side at which the coverlay film 61contacts the conductive circuit 12.

In addition, when the inner diameter of the pore 62 b of the resin film62 equals d₁, and the diameter of the conductive particle 14 equals d₂,the variables d₁ and d₂ satisfy the inequality d₁<d₂.

Further, the conductive particle 14 is inserted in the pore 62 b of theresin film 62 from a side 62 c of the resin film 62 where the resin film62 does not contact the adhesive layer 63 so that a top portion 14 a ofthe conductive particle 14 is exposed. Hereinafter, the side 62 c willbe referred to as “the other side 62 c.”

For example, the inner diameter d₁ of the pore 62 b of the resin film 62is set to 65 μm, and the diameter d₂ of the conductive particle 14 isset to 75 μm. Here, when the thickness of the resin film 62 is 12 μm,the top portion 14 a of the conductive particle 14 protrudes from theresin film 62 by approximately 5 μm.

Furthermore, an opening portion 61 a is provided on the coverlay film 61to mount an electronic component. This opening portion 61 a penetratesthe resin film 62 and the adhesive layer 63 in the direction of theirthickness. The conductive circuit 12 is exposed from this openingportion 61 a.

Polyimide resin, polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), aramid resin, and the like, are used as resin makingup the resin film 62.

An adhesive similar to the adhesive 30 is used as the adhesive making upthe adhesive layer 63.

According to this printed wiring board 60, the cover layer includes thecoverlay film 61. The pore 62 b is provided on the resin film 62 of thiscoverlay film 61. When the inner diameter of the pore 62 b equals andthe diameter of the conductive particle 14 equals d₂, the diameters d₁and d₂ satisfy the inequality d₁<d₂. In addition, the conductiveparticle 14 is inserted in the pore 62 b from one side 62 a of the resinfilm 62. In this way, the conductive particle 14 is fixed on one side 12a of the conductive circuit 12 while the top portion 14 a is exposedfrom the resin film 62. Therefore, when the printed wiring board 60 iselectrically connected to another printed wiring board via theconductive particle 14, this conductive particle is prevented fromshifting around. As a result, the printed wiring boards can be connectedwith more reliability.

Next, a method of connecting this printed wiring board 60 is providedwith reference to FIG. 6.

First, a conductive circuit 12 is provided on one side 11 a of theinsulated substrate 11.

In addition, separate from the above process, a pore is formed on thecoverlay film 61 including the resin film 62 and the adhesive material63. Then, the conductive particle 14 is placed on a side of the adhesivematerial on the pore.

Next, the coverlay film 61, along with the conductive particle, ispositioned so as to cover the conductive circuit 12. Then, the adhesivematerial 63 is fused by providing heat and pressure. In this way, aspace between the conductive particle 14 and the pore is filled with theadhesive material 63. At the same time, the coverlay film 61 is bondedtogether with the insulated substrate 11. In this way, the printedwiring board 60 is obtained.

Next, a method of connecting the printed wiring board 60 with anotherprinted wiring board is described with reference to FIG. 6.

According to the connection method of the printed wiring board accordingto the above embodiment, two printed wiring boards (printed wiring board60 and another printed wiring board (not diagramed)) are connected viaan adhesive.

Here, the other printed wiring board includes an insulated substrate, aconductive circuit provided on one side of the insulated substrate, anda cover layer covering the insulated substrate and the conductivecircuit. In addition, an opening portion is provided on the cover layer.The conductive circuit is exposed from this opening portion.

In other words, according to the connection method of the printed wiringboard based on the above embodiment, the top portion 14 a of theconductive particle 14 contacts the conductive circuit of the otherprinted wiring board. The top portion 14 a of the conductive particle 14protrudes from the resin film 62 of the printed wiring board 60. As aresult, these wiring boards are electrically connected through theconductive particle 14. At the same time, the contacting portion of theprinted wiring board 60, the other printed wiring board, and theconductive particle 14, as well as the area surrounding the contactingportion, are bonded with an adhesive. In this way, the electricalconnection between these wiring boards is fixed.

An adhesive similar to the adhesive 30 is used as the adhesive.

According to a connection method of a printed wiring board based on theabove embodiment, the printed wiring board 60 and another printed wiringboard are electrically connected via the conductive particle 14protruding from the resin film 62 of the printed wiring board 60.Therefore, when the printed wiring board 60 is electrically connected toanother printed wiring board, the conductive particle 14 is preventedfrom shifting around. As a result, the printed wiring boards can beconnected with more reliability.

(4) Fourth Embodiment

FIG. 7 is a skeletal cross-sectional diagram representing a printedwiring board according to a fourth embodiment of the present invention.

In FIG. 7, the components that are the same as those described in thefirst embodiment and shown in FIG. 1 are referenced using the samereference numbers. In this way, overlapping components will not bedescribed.

The printed wiring board 70 according to the fourth embodiment differsfrom the printed wiring board 10 according to the first embodiment, inthat the cover layer includes a coverlay film 71 comprising a resin film72 and an adhesive layer 73 provided on one side 72 a of the resin film72; a pore 72 b is provided on the resin film 72 of this coverlay film71; and a part of the conductive particle 14 is inserted in the pore 72b.

In other words, the adhesive layer 73 is placed so as to cover theconductive circuit 12 and the conductive particle 14 provided on oneside 12 a of the conductive circuit 12. At the same time, the coverlayfilm 71 is provided so that a part of the conductive particle 14 isinserted in the pore 72 b of the resin film 72 from one side 72 a of theresin film 72, in other words, from a side at which the coverlay film 71contacts the conductive circuit 12.

In addition, the pore 72 b is provided on the resin film 72 so that thepore 72 b is tapered from one side 72 a of the resin film 72 to theother side 72 c of the resin film 72. In other words, the inner diameterof the pore 72 b gradually decreases from the side of the resin film 72at which the coverlay film 71 contacts the conductive circuit 12, to theother side of the resin film 72.

Further, when the inner diameter of the pore 72 b at the other side 72 cof the resin film 72 equals d₃, and the inner diameter of the pore 72 bat one side 72 a of the resin film 72 equals d₄, the diameters d₃ and d₄satisfy the inequality d₃<d₄.

Moreover, the conductive particle 14 is inserted in the pore 72 b of theresin film so that the top portion 14 a of the conductive particle 14protrudes from the other side 72 c of the resin film 72.

For example, the inner diameter d₃ of the pore 72 b at the other side 72c of the resin film 72 is set to 65 μm, the inner diameter d₄ of thepore 72 b at one side 72 a of the resin film 72 is set to 80 μm, and thediameter of the conductive particle 14 is set to 75 μm. Here, when thethickness of the resin film 72 is 12 μm, the top portion 14 a of theconductive particle 14 protrudes from the resin film 72 by approximately20 μm.

Furthermore, an opening portion 71 a is provided on the coverlay film 71to mount an electronic component. The opening portion 71 a penetratesthe resin film 72 and the adhesive layer 73 in the direction of theirthickness. The conductive circuit 12 is exposed from this openingportion 71 a.

A material similar to the resin film 62 is used as a resin making up theresin film 72.

An adhesive similar to the adhesive 30 is used as an adhesive making upthe adhesive layer 73.

According to this printed wiring board 70, the cover layer includes thecoverlay film 71. The pore 72 b is provided on the resin film 72 of thecoverlay film 71. The diameter of the pore 72 b gradually decreases fromone side 72 a of the resin film 72 to the other side 72 c. When theinner diameter of the pore 72 b at the other side 72 c of the resin film72 equals d₃, and the inner diameter of the pore 72 b at one side 72 aof the resin film 72 equals d₄, the diameters d₃ and d₄ satisfy theinequality d₄<d₄. Since the conductive particle 14 is inserted in thepore 72 b from one side 72 a of the resin film 72 compared to the caseof the printed wiring board 60 described above, the conductive particle14 can be fixed on one side 12 a of the conductive circuit 12 while thetop portion 14 a of the conductive particle 14 protrudes from the resinfilm 72. Therefore, when the printed wiring board 70 and another printedwiring board are electrically connected via the conductive particle 14,the conductive circuits of each printed wiring board will not come intocontact with one another. Therefore, the printed wiring boards can beconnected without triggering a crosstalk of the conductive circuitbetween the printed wiring boards.

Next, a method of manufacturing the printed wiring board 70 is providedwith reference to FIGS. 8 to 13.

First, a coverlay film 71 as shown in FIG. 8 is prepared. This coverlayfilm 71 includes a resin film 72 and an adhesive layer 73 provided onone side 72 a of the resin film 72. An opening portion 71 a is providedon this coverlay film 71. This opening portion 71 a penetrates the resinfilm 72 and the adhesive layer 73 in the direction of their thickness.

Next, a laser beam 80 is applied to the coverlay film 71, as shown inFIG. 9, from the other side of the adhesive layer 73, at which theadhesive layer and the resin film 72 do not come in contact with oneanother.

As a result, as shown in FIG. 10, a pore 71 b is provided on thecoverlay film 71 so that the pore 71 b is tapered from a side of theadhesive layer 73 at which the adhesive layer 73 does not contact theresin film 72 (in other words, a side at which the coverlay film 71contacts the conductive circuit) to the other side 72 c of the resinfilm 72 (in other words, a side at which the coverlay film 71 contactsthe conductive circuit). The pore 72 b, described above, is a part ofthe pore 71 b. The pore 72 b corresponds to the portion of the pore 71 bprovided on the resin film 72.

When the inner diameter of the pore 71 b at a side of the coverlay film71 at which the coverlay film 71 does not contact the conductive circuitequals d₅, and the inner diameter of the pore 71 b at a side of thecoverlay film 71 at which the coverlay film 71 contacts the conductivecircuit equals d₆, the diameters d₅ and d₆ satisfy the inequality d₅<d₆.

In addition, when the inner diameter of the pore 72 b at the other side72 c of the resin film 72 equals d₃, and the inner diameter of the pore72 b at one side 72 a of the resin film 72 equals d₄, the diameters d₃and d₄ satisfy the inequality d₃<d₄.

Incidentally, the variables d₃ and d₅ satisfy the equation d₃=d₅.

Moreover, when the diameter of the conductive particle 14 equals d₂, thefollowing is met: (d₃=d₅)<d₄<d₂<d₆.

There is no particular limitation on the laser beam 80 applied to thecoverlay film 71. Examples of this laser beam 80 include an ultravioletlaser with a wavelength of 354 nm, which is a third harmonic of theNd:YVO4 laser; a carbon dioxide laser; and an exciplex laser.

Incidentally, according to the above embodiment, a laser beam is used toprovide a pore 71 b to the coverlay film 71. However, the method ofmanufacturing the printed wiring board according to the presentinvention is not limited to this configuration. For example, regardingthe manufacturing method of the printed wiring board according to thepresent invention, a punch with a convexed tip can be penetrated throughthe coverlay film from a side at which the coverlay film contacts theconductive circuit. In addition, it is also possible to provide a holethrough the coverlay film using a drill.

Next, as shown in FIG. 11, a conductive particle 14 is packed into thepore 71 b of the coverlay film 71 from a side of the adhesive layer 73at which the adhesive layer 73 does not contact the resin film 72. Then,a part of the conductive particle 14 is inserted to the pore 72 b of theresin film 72 so that a top portion 14 a of the conductive particle 14protrudes from the other side 72 c of the resin film 72. In this way acoverlay film 74 is formed. The conductive particle 14 is partiallyembedded in this coverlay film 74. Hereinafter, the coverlay film 74 maybe referred to as a “conductive particle-included coverlay film 74.”

Next, as shown in FIG. 12, the conductive particle-included coverlayfilm 74 is bonded with one side 11 a of the insulated substrate 11, andis temporarily fixed, so that the conductive particle 14 of theconductive particle-included coverlay film 74 contacts the conductivecircuit 12. This conductive circuit 12 is provided on one side 11 a ofthe insulated substrate 11, which is separately prepared.

In other words, the adhesive layer 73 of the conductiveparticle-included coverlay film 74 is placed, so that the conductiveparticle 14 of the conductive particle-included coverlay film 74contacts the conductive circuit 12, and the insulated substrate 11 andthe conductive circuit 12 are covered.

Next, conductive particle 14 is adhered to the conductive circuit 12 byheating the adhesive layer 73 and pressing the conductiveparticle-included coverlay film 74 against the insulated substrate 11.At the same time, the adhesive layer 73 is bonded to the insulatedsubstrate 11 and the conductive circuit 12. In this way, the printedwiring board 70 is formed, as shown in FIG. 13.

According to a method of manufacturing a printed wiring board accordingto the above embodiment, a pore 71 b is provided on the coverlay film71, so that the pore 71 b is tapered from a side of the coverlay film 71at which the coverlay film 71 contacts the conductive circuit 12, to theother side of the coverlay film 71 at which the coverlay film 71 doesnot contact the conductive circuit 12.

Further, a part of the conductive particle 14 is inserted in the pore 71b from a side of the coverlay film 71 at which the coverlay film 71contacts the conductive circuit 12, so that a top portion 14 a of theconductive particle 14 protrudes from the other side 72 c of the resinfilm 72. In this way, the conductive particle-included coverlay film 74is formed. Thereinafter, this conductive particle-included coverlay film74 is bonded with the insulated substrate 11 on which the conductivecircuit 12 is equipped. As a result, the conductive particle 14 can befixed to one side 12 a of the conductive circuit 12 while the topportion 14 a of the conductive particle 14 protrudes from the resin film72.

Next, a method of connecting the printed wiring board 70 to anotherprinted wiring board is described, with reference to FIGS. 14 to 16.

FIGS. 14 to 16 are skeletal cross-sectional diagrams representing amethod of connecting a printed wiring board according to the fourthembodiment of the present invention.

In FIGS. 14 to 16, components that are the same as those described inthe second embodiment and shown in FIG. 5 are referenced using the samereference numbers. In this way, overlapping components will not bedescribed.

According to the connection method of the printed wiring board based onthe above embodiment, two printed wiring boards (printed wiring board 20and printed wiring board 70) are connected via an adhesive 81.

In other words, according to the connection method of this printedwiring board, the adhesive 81 is first applied to a part of the otherside 72 c of the resin film 72 of the coverlay film 71, as shown in FIG.14. At this time, the adhesive 81 is applied so as to cover theconductive particle 14.

An adhesive similar to the adhesive 30 is used as the adhesive 81.

Next, the adhesive 81 applied to the printed wiring board 70 contactsthe cover layer 23 of the printed wiring board 20, so that theconductive particle 14 covered by the adhesive layer 81 is placed at aposition facing the opening portion 23 a of the printed wiring board 20,as shown in FIG. 15, and is then fixed temporarily to maintain thiscondition.

Next, the adhesive 81 is heated. The printed wiring board 70 is pressedagainst the printed wiring board 20. As a result, the conductiveparticle 14 contacts the conductive circuit 22 of the printed wiringboard 20, as shown in FIG. 16. This conductive particle 14 is placed onone side 12 a of the conductive circuit 12 of the printed wiring board70. In this way, the printed wiring board 20 and the printed wiringboard 70 are electrically connected via the conductive particle 14. Atthe same time, the contacting portion of the printed wiring board 20,the printed wiring board 70, and the conductive particle 14, as well asits surrounding area, are bonded by the adhesive 81. As a result, theelectrical connection between these wiring boards is fixed.

In other words, the adhesive 81 is heated and dissolved. Then, theprinted wiring board 70 is pressed against the printed wiring board 20.As a result, the conductive particle 14 penetrates the adhesive 81.Further, the conductive particle 14 contacts the conductive circuit 22of the printed wiring board 20. Then, the heating is suspended, and theadhesive 81 is solidified. In this way, the printed wiring board 20 isbonded to the printed wiring board 70 via the adhesive 81.

According to the connection method of the printed wiring board based onthe above embodiment, the adhesive 81 is applied to a part of the otherside 72 c of the resin film 72, so that the adhesive 81 covers theconductive particle 14 protruding from the resin film 72 of the printedwiring board 70. The printed wiring board 20 and the printed wiringboard 70 are bonded together by this adhesive 81. As a result, theprinted wiring board 20 and the printed wiring board 70 are electricallyconnected via the conductive particle 14. Therefore, the conductiveparticle 14 is prevented from shifting around when the printed wiringboard 20 is electrically connected to the printed wiring board 70.Consequently, the printed wiring boards can be connected to one anotherwith more reliability.

While a preferred embodiment of the present invention has been describedabove, it should be understood that these are exemplary of the inventionand are not to be considered as limiting the present invention.Additions, omissions, substitutions, and other modifications can be madewithout departing from the spirit or scope of the present invention. Theinvention is not to be considered as being limited by the foregoingdescription, and is only limited by the scope of the appended claims.

1. A printed wiring board comprising: an insulated substrate; aconductive circuit provided on one side of this insulated substrate; acover layer covering the insulated substrate and the conductive circuit;and a conductive particle buried in this cover layer, wherein theconductive particle is buried in the cover layer so that the conductiveparticle contacts the conductive circuit and protrudes from the coverlayer; and the conductive particle serves as an electric contact point.2. A printed wiring board according to claim 1, wherein an adhesivelayer is provided on at least a part of a side opposite to a side atwhich the cover layer contacts the conductive circuit, and this adhesivelayer covers the conductive particle.
 3. A printed wiring boardaccording to claim 2, wherein the adhesive layer includes athermoplastic resin.
 4. A printed wiring board according to claim 1,wherein the cover layer includes a coverlay film; a pore is provided onthis coverlay film; an inequality d₁<d₂ is satisfied when an innerdiameter of the pore equals d₁ and the diameter of the conductiveparticle equals d₂; and the conductive particle is inserted in the porefrom a side at which the coverlay film contacts the conductive circuit.5. A printed wiring board according to claim 1, wherein the cover layerincludes a coverlay film; a pore is provided on this coverlay film, thepore tapering gradually from a first side at which the coverlay filmcontacts the conductive circuit to a second side opposite to the firstside at which the coverlay film contacts the conductive circuit; aninequality d₃<d₄ is satisfied when d₃ equals an inner diameter of thepore at the second side opposite to the first side at which the coverlayfilm contacts the conductive circuit, and d₄ equals another innerdiameter of the pore at the first side at which the coverlay filmcontacts the conductive circuit; and the conductive particle is insertedin the pore from the first side at which the coverlay film contacts theconductive circuit.
 6. A printed wiring board according to claim 1,wherein the conductive particle includes a resin particle and a metallayer formed on a surface of this resin particle.
 7. A connection methodof a printed wiring board connecting a first printed wiring boardcomprising an insulated substrate, a conductive circuit provided on oneside of this insulated substrate, a cover layer covering the insulatedsubstrate and the conductive circuit, and a conductive particle buriedin this cover layer, wherein the conductive particle is buried in thecover layer so that the conductive particle contacts the conductivecircuit and protrudes from the cover layer; and a second printed wiringboard comprising an insulated substrate, a conductive circuit providedon one side of this insulated substrate, a cover layer covering theinsulated substrate and the conductive circuit, wherein at least a partof the conductive circuit is exposed; the connection method comprising:a step contacting the conductive particle of the first printed wiringboard with the conductive circuit of the second printed wiring board;and a step bonding a contacting portion of the conductive particle andthe conductive circuit, as well as an area surrounding the contactingportion, with an adhesive.
 8. A connection method of a printed wiringboard according to claim 7, wherein the adhesive includes athermoplastic resin.
 9. A connection method of a printed wiring boardaccording to claim 7, wherein the adhesive includes an adhesive layercovering the conductive particle; and the adhesive layer is provided onat least a part of a side opposite to a side at which the cover layercontacts the conductive circuit.
 10. A connection method of a printedwiring board according to claim 7, wherein the cover layer includes acoverlay film; a pore is provided on this coverlay film; an inequalityd₁<d₂ is satisfied when an inner diameter of the pore equals d₁ and adiameter of the conductive particle equals d₂; the connection methodfurther comprising a step inserting the conductive particle in the porefrom a side at which the coverlay film contacts the conductive circuit.11. A connection method of a printed wiring board according to claim 7,wherein the cover layer includes a coverlay film; a pore is provided onthis coverlay film, the pore tapering gradually from a first side atwhich the coverlay film contacts the conductive circuit to a second sideopposite to the first side at which the coverlay film contacts theconductive circuit; an inequality d₃<d₄ is satisfied when d₃ equals aninner diameter of the pore at the second side opposite to the first sideat which the coverlay film contacts the conductive circuit, and d₄equals another inner diameter of the pore at the first side at which thecoverlay film contacts the conductive circuit; the connection methodfurther comprising a step inserting the conductive particle in the porefrom the first side at which the coverlay film contacts the conductivecircuit.
 12. A connection method of a printed wiring board according toclaim 7, wherein the conductive particle includes a resin particle and ametal layer formed on a surface of this resin particle; and theconductive particle is connected to a terminal of the second printedwiring board by pressing the first printed wiring board and the secondprinted wiring board, and by having the conductive particle undergo anelastic deformation or a plastic deformation.
 13. A manufacturing methodof a printed wiring board comprising an insulated substrate, aconductive circuit provided on one side of this insulated substrate, acover layer covering the insulated substrate and the conductive circuit,and a conductive particle buried in this cover layer, the manufacturingmethod comprising: a step providing the conductive circuit on one sideof the insulated substrate; a step providing the conductive particle ona side opposite to a side at which the conductive circuit contacts theinsulated substrate; a step providing the cover layer so that at least atop portion of the conductive particle is exposed, and the cover layercovers the insulated substrate and the conductive circuit.
 14. Amanufacturing method of a printed wiring board comprising an insulatedsubstrate, a conductive circuit provided on one side of this insulatedsubstrate, a cover layer covering the insulated substrate and theconductive circuit, and a conductive particle buried in this coverlayer, the manufacturing method comprising: a step providing theconductive circuit on one side of the insulated substrate; a step usinga coverlay film as a material of the cover layer and providing a pore onthis coverlay film; a step packing the conductive particle in the poreso that at least a top portion of the conductive particle is exposed;and a step bonding the coverlay film, in which the conductive particleis packed, with the insulated substrate, on which the conductive circuitis provided, so that the conductive particle contacts the conductivecircuit.
 15. A manufacturing method of a printed wiring board accordingto claim 14, wherein the step providing the pore on the coverlay filmincludes: providing a tapered pore on the coverlay film so that adiameter of the tapered pore gradually decreases from a side at whichthe coverlay film contacts the conductive circuit to a side opposite tothe side at which the coverlay film contacts the conductive circuit.